论文信息 - Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC Integration - 字舞流文

Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC Integration

M. Kao | W. Lo | J. Lau | Y. Chao | H. Chien | Shang-Tsai Wu