Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications

Abstract Currently, Ag die-attach techniques, using nano-silver particles, are of high interest for manufacturing of wide-band-gap (WBG) power module due to their high-temperature operation capability. However, the high cost of silver and complicated processing requirements are the main driving force in the search for simpler and more cost-effective attached technologies. In this study, a new die-attach technique based on silver die-attach, without conventional Ag-paste, for high-temperature applications is developed. Glass containing Ag paste was pre-sintered on the DBA substrates, and later on, semiconductor dies were simply placed on this pre-sintered Ag layer and attached under heat and pressure. The samples were tested under shear and thermal cycling loadings (−45 °C/250 °C) to evaluate the quality and reliability. Destructive and non-destructive analysis methods, such as Scanning Acoustic Tomography and cross-section observation, were used to identify fracture modes. The samples demonstrated sufficient shear strength and high thermal reliability. Furthermore, the effects of Ag recrystallization, grain growth and rearrangement of the voids are considered to be the main fracture factor of conventional Ag die-attach joints based on sample's cross-sections.

[1]  Kuan Yew Cheong,et al.  Die Attach Materials for High Temperature Applications: A Review , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[2]  F. Patrick McCluskey,et al.  High Temperature Electronics , 1997 .

[3]  A. Hirose,et al.  Direct Bonding to Aluminum with Silver-Oxide Microparticles , 2009 .

[4]  H. Sosiati,et al.  Changes in Microstructure of Al/AlN Interface during Thermal Cycling , 2008 .

[5]  K. S. Siow,et al.  Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? , 2014, Journal of Electronic Materials.

[6]  F. Patrick McCluskey,et al.  Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications , 2014, Microelectron. Reliab..

[7]  F. McCluskey,et al.  Reliability of paste based transient liquid phase sintered interconnects , 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

[8]  Satoshi Yamaguchi,et al.  Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography , 2016, Microelectron. Reliab..

[9]  A. Schletz,et al.  Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications , 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).

[10]  K. S. Kim,et al.  Low-temperature low-pressure die attach with hybrid silver particle paste , 2012, Microelectron. Reliab..

[11]  M. Ishikawa,et al.  Application of Gold-Tin Solder Paste for Fine Parts and Devices , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[12]  F. McCluskey,et al.  Reliability and failure analysis of Cu-Sn transient liquid phase sintered (TLPS) joints under power cycling loads , 2015, 2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA).

[13]  Katsuaki Suganuma,et al.  Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices , 2017, Journal of Electronic Materials.

[14]  Chulmin Oh,et al.  Pressureless Bonding Using Sputtered Ag Thin Films , 2014, Journal of Electronic Materials.

[15]  Philippe Godignon,et al.  Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications , 2014, IEEE Transactions on Power Electronics.

[16]  Z. Wang,et al.  Reliability of high temperature solder alternatives , 2006, Microelectron. Reliab..

[17]  F. McCluskey,et al.  Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints , 2014 .

[18]  K. S. Siow,et al.  Mechanical properties of nano-silver joints as die attach materials , 2012 .

[19]  Andreas Schletz,et al.  Reliability of insulating substrates — High temperature power electronics for more electric aircraft , 2011, Proceedings of the 2011 14th European Conference on Power Electronics and Applications.

[20]  K.D.T. Ngo,et al.  Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate , 2009, IEEE Transactions on Device and Materials Reliability.