Extremely high temperature and high pressure (x-HTHP) endurable SOI device & sensor packaging for deep sea, oil and gas applications
暂无分享,去创建一个
[1] Min Woo Daniel Rhee,et al. Process characterization of highly conductive silver paste die attach materials for thin die on QFN , 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
[2] Vempati Srinivasa Rao,et al. Study on silver sintered die attach material with different metal surfaces for high temperature and high pressure (300°c/30kpsi) applications , 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
[3] V. Chidambaram,et al. Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics , 2012, Journal of Electronic Materials.