Design and implementation of shared BISR for RAMs: A case study

As transistors' sizes of embedded memory continue to shrink and the valuable silicon is becoming the draining resources, it is the prevalent trend that multi-memory structures exist in the current SOC design to achieve better performance. Due to the imperfect manufacturing processes, it may introduce the faults to the designs. Built-In Self-Test(BIST) and Self-Repair(BISR) are the better test and repair methods for embedded memory, however, to the single embedded memory, both BIST and BISR are unacceptable in multi-memory design and the redundancies resources in memories which manufacturers provide are very limited. It is inefficient to use the traditional redundancy resource allocation algorithms, instead of using a more precise BISR structure to improve both the repair rate of RAMs and the resource utilization of redundancies, as well as, reducing the silicon area overhead of BISR circuits. For these aims, this paper proposes a shared self-repair design that uses Context Addressable Memory(CAM) as the operation units of fault information. In the paper, it clearly presents the special components of design and the corresponding working principles. We implemented this structure in real industrial microprocessors. Experimental results demonstrate the effectiveness of the proposed structure.

[1]  Albert V. Ferris-Prabhu,et al.  Introduction To Semiconductor Device Yield Modeling , 1992 .

[2]  Gang Wang,et al.  A revised low power test architecture , 2012, 2012 International Symposium on Communications and Information Technologies (ISCIT).

[3]  Hideo Fujiwara,et al.  A memory grouping method for sharing memory BIST logic , 2006, Asia and South Pacific Conference on Design Automation, 2006..

[4]  Jin-Fu Li,et al.  Cost-Efficient Built-In Redundancy Analysis With Optimal Repair Rate for RAMs , 2012, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

[5]  Gang Wang,et al.  Test and Repair Flow for Shared BISR in Asynchronous Multi-processors , 2014, 2014 20th IEEE International Symposium on Asynchronous Circuits and Systems.

[6]  Yervant Zorian,et al.  Built in self repair for embedded high density SRAM , 1998, Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270).

[7]  Gang Wang,et al.  A testability-aware low power architecture , 2012, 2012 IEEE International SOC Conference.

[8]  Yervant Zorian,et al.  Principles of testing electronic systems , 2000 .

[9]  Gang Wang A robust repair-aware test method for multi-memory , 2013, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

[10]  Jin-Fu Li,et al.  ReBISR: A Reconfigurable Built-In Self-Repair Scheme for Random Access Memories in SOCs , 2010, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[11]  Shyue-Kung Lu,et al.  Efficient BISR Techniques for Word-Oriented Embedded Memories with Hierarchical Redundancy , 2006, 5th IEEE/ACIS International Conference on Computer and Information Science and 1st IEEE/ACIS International Workshop on Component-Based Software Engineering,Software Architecture and Reuse (ICIS-COMSAR'06).

[12]  Jin-Fu Li,et al.  A Shared Parallel Built-In Self-Repair Scheme for Random Access Memories in SOCs , 2008, 2008 IEEE International Test Conference.

[13]  William R. Eisenstadt,et al.  A low-power CAM using a 12-transistor design cell , 2007, 2007 IFIP International Conference on Very Large Scale Integration.

[14]  Yu-Jen Huang,et al.  DABISR: A Defect-Aware Built-In Self-Repair Scheme for Single/Multi-Port RAMs in SoCs , 2010, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.