A three-dimensional microfabrication technology on highly structured surfaces

This study presents a simple process to realize the lithography and deposition on a complicated three-dimensional 3D substratesurface conformally. The 3D lithography and patterning on a highly structured surface is implemented using the self-assembledmonolayer SAM coating and the plasma treatment. Moreover, the selective film deposition on a 3D surface and even underneaththe suspended microstructures is realized using the contact displacement electroless plating. In applications, the Cu film wasconformally plated and patterned on a Si substrate with 50–200 m deep cavities and 54.7–90° sidewalls. Moreover, the Cuelectrode underneath suspended microbeams was also plated.© 2006 The Electrochemical Society. DOI: 10.1149/1.2363949 All rights reserved.Manuscript submitted June 7, 2006; revised manuscript received August 11, 2006. Available electronically November 3, 2006.