论文信息 - Defect and electromigration characterization of a two level copper interconnect - 字舞流文

Defect and electromigration characterization of a two level copper interconnect

Robin W. Cheung | G. Dixit | J. Educato | V. Rana | S. Parikh | A. Wang | B. Zheng | K. Wijekoon | J. Chen