The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade

From cell phones to biomedical systems, modern life is inexorably dependent on the complex convergence of technologies into stand-alone products designed to provide a complete solution in small, highly integrated systems with computing, communication, biomedical and consumer functions. The concept of system-on-package (SOP) originated in the mid-1990s at the NSF-funded Packaging Research Center at the Georgia Institute of Technology. This can be thought of as a conceptual paradigm in which the package, and not the bulky board, as the system and the package provides all the system functions in one single module, not as an assemblage of discrete components to be connected together, but as a continuous merging of various integrated thin film technologies in a small package. In the SOP concept, this is accomplished by codesign and fabrication of digital, optical, RF and sensor functions in both IC and the package, thus distinguishing between what function is accomplished best at IC level and at package level. In this paradigm, ICs are viewed as being best for transistor density while the package is viewed as being best for RF, optical and certain digital-function integration. The SOP concept is demonstrated for a conceptual broad-band system called an intelligent network communicator (INC). Its testbed acts as both a leading-edge research and teaching platform in which students, faculty, research scientists, and member companies evaluate the validity of SOP technology from design to fabrication to integration, test, cost and reliability. The testbed explores optical bit stream switching up to 100 GHz, digital signals up to 5-20 GHz, decoupling capacitor integration concepts to reduce simultaneous switching noise of power beyond 100 W/chip, design, modeling and fabrication of embedded components for RF, microwave, and millimeter wave applications up to 60 GHz. This article reviews a number of SOP technologies which have been developed and integrated into SOP test bed. These are: 1) convergent SOP-based INC system design and architecture, 2) digital SOP and its fabrication for signal and power integrity, 3) optical SOP fabrication with embedded actives and passives, 4) RF SOP for high Q-embedded inductors, filters and other RF components, 5) mixed signal electrical test, 6) mixed signal reliability, and 7) demonstration of SOP by INC prototype system.

[1]  Abhijit Chatterjee,et al.  System-level testing of RF transmitter specifications using optimized periodic bitstreams , 2004, 22nd IEEE VLSI Test Symposium, 2004. Proceedings..

[2]  Suresh K. Sitaraman,et al.  Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages , 2001 .

[3]  Suresh K. Sitaraman,et al.  Die cracking and reliable die design for flip-chip assemblies , 1999, ECTC 1999.

[4]  R. Master,et al.  Modeling of power supply noise in large chips using the circuit-based finite-difference time-domain method , 2005, IEEE Transactions on Electromagnetic Compatibility.

[5]  Yang Rao,et al.  Material characterization of high dielectric constant polymer-ceramic composite for embedded capacitor to RF application , 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

[6]  J. Laskar,et al.  RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology , 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).

[7]  Jinseong Choi.  Modeling of power supply noise in large chips using the finite difference time domain method , 2002 .

[8]  David C. Keezer,et al.  A production-oriented multiplexing system for testing above 2.5 gbps , 2003, International Test Conference, 2003. Proceedings. ITC 2003..

[9]  M. Tentzeris,et al.  Advanced System-on-Package RF Front-ends for Emerging Wireless Communications ( Invited paper ) , 2002 .

[10]  Nan Marie Jokerst,et al.  Embedded optical interconnections using thin film InGaAs metal-semiconductor-metal photodetectors , 2002 .

[11]  Keren Bergman,et al.  Application and demonstration of a digital test core: optoelectronic test bed and wafer-level prober , 2003, International Test Conference, 2003. Proceedings. ITC 2003..

[12]  M. Swaminathan,et al.  Construction of broadband passive macromodels from frequency data for simulation of distributed interconnect networks , 2004, IEEE Transactions on Electromagnetic Compatibility.

[13]  Sang-Woo Seo,et al.  Embedded optical interconnections on printed wiring boards , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[14]  Joy Laskar,et al.  Intelligent network communicator: highly integrated system-on-package (SOP) testbed for RF/digital/opto applications , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[15]  Suresh K. Sitaraman,et al.  Role of base substrate material on dielectric and copper interlayer separation , 2002 .

[16]  Pulugurtha Markondeya Raj,et al.  Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C) , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[17]  D. Balaraman,et al.  Novel hydrothermal processing (<100/spl deg/C) of ceramic-polymer composites for integral capacitor applications , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[18]  Joy Laskar,et al.  Gigabit wireless: system-on-a-package technology , 2004, Proceedings of the IEEE.

[19]  Madhavan Swaminathan,et al.  Modeling of multilayered power distribution planes using transmission matrix method , 2002 .

[20]  H.P. Hofstee,et al.  Future microprocessors and off-chip SOP interconnect , 2004, IEEE Transactions on Advanced Packaging.

[21]  Motoo Asai.  New Packaging Substrate Technology,Ibss (Interpenetrating Polymer Network Build Up Structure System) , 1996 .

[22]  Martin A. Brooke,et al.  Optical interconnections on electrical boards using embedded active optoelectronic components , 2003 .

[23]  Suresh K. Sitaraman,et al.  An integrated process modeling methodology and module for sequential multi-layered substrate fabrication using a coupled cure-thermal-stress analysis approach , 2000, ECTC 2000.

[24]  K. Segawa.  Build-up PWB with laser-processed via holes VIL , 1998 .

[25]  Yang Rao,et al.  Material characterization of high dielectric constant polymer-ceramic composite for embedded capacitor to RF application , 2002 .

[26]  Boris Mirman.  Discussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988 , 1990 .

[27]  S. Bhattacharya,et al.  Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[28]  R.R. Tummala,et al.  Next-generation microvia and global wiring technologies for SOP , 2004, IEEE Transactions on Advanced Packaging.

[29]  Kyutae Lim,et al.  Multi-layer fully organic-based system on package (SOP) technology for RF applications , 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

[30]  Suresh K. Sitaraman,et al.  Cure kinetics modeling and process optimization of the vialux 81 epoxy photodielectric dry film (PDDF) material for microvia applications , 2002 .

[31]  Fuhan Liu,et al.  A novel technology for stacking microvias on printed wiring board , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[32]  Suresh K. Sitaraman,et al.  Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction , 2002 .

[33]  Sudipto Chakraborty,et al.  Integrated RF architectures in fully-organic SOP technology , 2002 .

[34]  Lixi Wan,et al.  Development and characterization of embedded thin-film capacitors for mixed signal applications on fully organic system-on-package technology , 2002, Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573).

[35]  Kyutae Lim,et al.  Design of compact stacked-patch antennas on LTCC technology for wireless communication applications , 2002, IEEE Antennas and Propagation Society International Symposium (IEEE Cat. No.02CH37313).

[36]  Kyutae Lim,et al.  Development of planar antennas in multi-layer packages for RF-system-on-a-package applications , 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).

[37]  Kyutae Lim,et al.  Novel combiner for hybrid digital/RF fiber-optic application , 2002, Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573).

[38]  Suresh K. Sitaraman,et al.  Interfacial fracture toughness measurement for thin film interfaces , 2004 .

[39]  Gee-Kung Chang,et al.  Design, fabrication, and reliability testing of embedded optical interconnects on package , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[40]  A. T. Murphy,et al.  High frequency performance of multilayer capacitors , 1995 .

[41]  Tadashi Nakamura,et al.  The progress of the ALIVH substrate , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[42]  Manos M. Tentzeris,et al.  W-band characterization of finite ground coplanar transmission lines on liquid crystal polymer (LCP) substrates , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[43]  Yutaka Tsukada,et al.  Surface laminar circuit packaging , 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.

[44]  Richard Ulrich,et al.  Integrated passive component technology , 2003 .

[45]  April S. Brown,et al.  InGaAs MSM photodetectors modeling using DOE analysis , 2004, SPIE Optics + Photonics.

[46]  Yuji Yano,et al.  Three-dimensional very thin stacked packaging technology for SiP , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[47]  Suresh K. Sitaraman,et al.  Enhanced reliability of high-density wiring (HDW) substrates through new base substrate and dielectric materials , 2004 .

[48]  Vijay K. Madisetti,et al.  System on Chip or System on Package? , 1999, IEEE Des. Test Comput..

[49]  H. Griem,et al.  High-performance back-illuminated InGaAs/InAlAs MSM photodetector with a record responsivity of 0.96 A/W , 1992, IEEE Photonics Technology Letters.

[50]  Manos M. Tentzeris,et al.  Integration of miniaturized patch antennas with high dielectric-constant multilayer packages and soft-and-hard surfaces (SHS) , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[51]  Rao Tummala,et al.  Simultaneous switching noise suppression for high speed systems using embedded decoupling , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

[52]  Nan Marie Jokerst,et al.  Polymer waveguide optical interconnections for electrical interconnection substrates , 2002, CLEO 2002.

[53]  D.C. Keezer,et al.  Low-cost strategies for testing multi-gigahertz SOPs and components , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).