The effect of HF/NH4F etching on the morphology of surface fractures on fused silica
暂无分享,去创建一个
T. Suratwala | M. Feit | L. Wong | P. Miller | R. Steele
[1] G. G. Stokes. "J." , 1890, The New Yale Book of Quotations.
[2] C. H. Desch. Aggregation and flow of solids. By Sir G. Beilby. Pp. xv.+256. (London: Macmillan and Co., Ltd. 1921.) Price 20s. net , 1922 .
[3] F W Preston,et al. The structure of abraded glass surfaces , 1922 .
[4] T. Vries,et al. The thermodynamics of aqueous hydrofluoric acid solutions. , 1947, Journal of the American Chemical Society.
[5] F. C. Roesler,et al. Brittle Fractures near Equilibrium , 1956 .
[6] D. E. Gray,et al. American Institute of Physics Handbook , 1957 .
[7] S. Wiederhorn,et al. Crack Healing in Glass , 1970 .
[8] J. Judge. A Study of the Dissolution of SiO2 in Acidic Fluoride Solutions , 1971 .
[9] W. D. Kingery,et al. Introduction to Ceramics , 1976 .
[10] J. T. Hagan,et al. Cone cracks around Vickers indentations in fused silica glass , 1979 .
[11] H. S. Fogler,et al. Dissolution kinetics: Catalysis by strong acids , 1981 .
[12] H. Scott Fogler,et al. Dissolution of silicate minerals by hydrofluoric acid , 1981 .
[13] L. Cook. Chemical processes in glass polishing , 1990 .
[14] T. Ohmi,et al. Principles of wet chemical processing in ULSI microfabrication , 1991 .
[15] I. Hutchings. Tribology: Friction and Wear of Engineering Materials , 1992 .
[16] H. Proksche,et al. The Influence of NH 4 F on the Etch Rates of Undoped SiO2 in Buffered Oxide Etch , 1992 .
[17] Masayuki Miyashita,et al. Etching Rate and Mechanism of Doped Oxide in Buffered Hydrogen Fluoride Solution , 1992 .
[18] G. Spierings. Wet chemical etching of silicate glasses in hydrofluoric acid based solutions , 1993 .
[19] Brian Lawn,et al. Fracture of brittle solids: Atomic aspects of fracture , 1993 .
[20] Donald Golini,et al. Effect of Etching and Imaging Mode on the Measurement of Subsurface Damage in Microground Optical Glasses , 1994 .
[21] Stella W. Pang,et al. Micromachining and Microfabrication Process Technology II , 1996 .
[22] Mark R. Kozlowski,et al. Depth profiling of polishing-induced contamination on fused silica surfaces , 1998, Laser Damage.
[23] Mark R. Kozlowski,et al. Effects of wet etch processing on laser-induced damage of fused silica surfaces , 1999, Laser Damage.
[24] H. Bender,et al. Comparison between wet HF etching and vapor HF etching for sacrificial oxide removal , 2000 .
[25] Michael D. Feit,et al. Influence of subsurface cracks on laser-induced surface damage , 2004, SPIE Laser Damage.
[26] Philip E. Miller,et al. MRF applications: measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique , 2005, SPIE Laser Damage.
[27] C. Iliescu,et al. Wet etching of glass , 2005, CAS 2005 Proceedings. 2005 International Semiconductor Conference, 2005..
[28] P. Miller,et al. Sub-surface mechanical damage distributions during grinding of fused silica , 2005 .
[29] Joseph A. Menapace,et al. The distribution of subsurface damage in fused silica , 2005, SPIE Laser Damage.