Photons, electrons, and acid yields in EUV photoresists: a progress report

This paper describes our initial investigation into building a greater understanding of the complex mechanism occurring during extreme ultraviolet (EUV) exposure of resist materials. In particular, we are focusing on the number and energy of photoelectrons generated and available for reaction with photoacid generators (PAGs). We propose that this approach will best enable the industry to develop resists capable of meeting resolution, line width roughness (LWR), and sensitivity requirements.

[1]  Kenneth A. Goldberg,et al.  Calibration of EUV 2D photoresist simulation parameters for accurate predictive modeling , 2003, SPIE Advanced Lithography.

[2]  Boris V. Yakshinskiy,et al.  Carbon accumulation and mitigation processes, and secondary electron yields of ruthenium surfaces , 2007, SPIE Advanced Lithography.

[3]  Yung-Fu Chen DERIVATION OF INELASTIC-ELECTRON-SCATTERING CROSS SECTIONS FROM QUANTITATIVE ANALYSIS OF REFLECTION-ELECTRON-ENERGY-LOSS SPECTRA , 1998 .

[4]  Gerd Pohlers,et al.  Comparison of acid-generating efficiencies in 248 and 193-nm photoresists , 2001, SPIE Advanced Lithography.

[5]  Jonathan L. Cobb,et al.  EUV Lithography: Patterning to the End of the Road , 2001 .

[6]  Roger F. Sinta,et al.  Contributions to innate material roughness in resist , 2006, SPIE Advanced Lithography.

[7]  L. Ocola Electron-Matter Interactions in X-Ray and Electron Beam Lithography. , 1996 .

[8]  Takahiro Kozawa,et al.  Radiation and photochemistry of onium salt acid generators in chemically amplified resists , 2000, Advanced Lithography.

[9]  Takahiro Kozawa,et al.  Relation between spatial resolution and reaction mechanism of chemically amplified resists for electron beam lithography , 2003 .

[10]  E. Anderson,et al.  Resists for next generation lithography , 2001 .

[11]  Theodore H. Fedynyshyn,et al.  PAG segregation during exposure affecting innate material roughness , 2009, Advanced Lithography.

[12]  Franco Cerrina,et al.  Comprehensive model of electron energy deposition , 2002 .

[13]  Jonathan L. Cobb,et al.  Comparison of the lithographic properties of positive resists upon exposure to deep- and extreme-ultraviolet radiation , 1999 .

[14]  Peter Trefonas,et al.  Resist effects at small pitches , 2006 .

[15]  T. Madey,et al.  DIET processes on ruthenium surfaces related to extreme ultraviolet lithography (EUVL) , 2008 .

[16]  Nicholas J. Turro,et al.  Photo-CIDNP and nanosecond laser flash photolysis studies on the photodecomposition of triarylsulfonium salts , 1992 .

[17]  Robert L. Brainard,et al.  Effect of polymer molecular weight on AFM polymer aggregate size and LER of EUV resists , 2003, SPIE Advanced Lithography.

[18]  S. Tagawa,et al.  Modeling and simulation of chemically amplified electron beam, x-ray, and EUV resist processes , 2004 .

[19]  Hans Loeschner,et al.  Measuring acid generation efficiency in chemically amplified resists with all three beams , 1999 .

[20]  Patrick P. Naulleau,et al.  Fundamental limits to EUV photoresist , 2007, SPIE Advanced Lithography.

[21]  Hiroki Yamamoto,et al.  Dependence of acid generation efficiency on the protection ratio of hydroxyl groups in chemically amplified electron beam, x-ray and EUV resists , 2004 .

[22]  Donald C. Hofer,et al.  PHOTOCHEMICAL AND PHOTOPHYSICAL STUDIES ON CHEMICALLY AMPLIFIED RESISTS , 1992 .

[23]  W. Schnabel,et al.  Photoinitation of cationic polymerization. II. Laser flash photolysis of diphenyliodonium salts , 1984 .

[24]  Peter Trefonas,et al.  Shot noise, LER, and quantum efficiency of EUV photoresists , 2004, SPIE Advanced Lithography.

[25]  Theodore H. Fedynyshyn,et al.  Component segregation in model chemically amplified resists , 2007, SPIE Advanced Lithography.

[26]  T. Madey,et al.  Electron stimulated desorption of anionic fragments from films of pure and electron-irradiated thiophene. , 2006, The Journal of chemical physics.

[27]  Nigel P. Hacker,et al.  Photochemistry of Triarylsulfonium Salts. , 1990 .

[28]  Takahiro Kozawa,et al.  Basic Aspects of Acid Generation Processes in Chemically Amplified Electron Beam Resist , 2005 .

[29]  Kenneth A. Goldberg,et al.  Performance of EUV photoresists on the ALS micro exposure tool , 2005, SPIE Advanced Lithography.

[30]  Theodore H. Fedynyshyn,et al.  Changes in resist glass transition temperatures due to exposure , 2007, SPIE Advanced Lithography.

[31]  Franco Cerrina,et al.  Stochastic modeling of high energy lithographies , 2003 .

[32]  Takahiro Kozawa,et al.  Deprotonation mechanism of poly(4-hydroxystyrene) and its derivative , 2005, SPIE Advanced Lithography.

[33]  Takahiro Kozawa,et al.  Basic aspects of acid generation processes in chemically amplified resists for electron beam lithography , 2005, SPIE Advanced Lithography.

[34]  Nigel P. Hacker,et al.  Photochemistry of diaryliodonium salts , 1990 .