Method for pressing multi-layer rigid-flexible combined circuit board

The method provides a method for pressing a multi-layer rigid-flexible combined circuit board, which comprises the following steps: grouping, superposing, clamping, pre-pressing, superposing and once pressing. Through the six steps, a plurality of rigid circuit boards and flexible circuit boards are made into a rigid-flexible combined circuit board. By using such a pressing method, the problems of bubbles, layering and inclined positioned board layers are reduced, and the rejection rate of the multi-layer rigid combined circuit board in the manufacturing process is reduced, thereby lowering the production cost.