Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu lead-free solder joint on Au/Ni/Cu substrate
暂无分享,去创建一个
S. L. Ngoh | X.Q. Shi | A. Spowage | H. Pang | W. Zhou | X. Shi
[1] S. L. Ngoh,et al. Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints , 2004 .
[2] K. Tu,et al. Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .
[3] Masazumi Amagai,et al. A mechanical reliability assessment of solder joints , 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).
[4] C. Kao,et al. Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering , 2001 .
[5] H. Conrad,et al. Microstructure coarsening during static annealing of 60Sn40Pb solder joints: II eutectic coarsening kinetics , 2001 .
[6] H. Conrad,et al. Microstructure coarsening during static annealing of 60Sn40Pb solder joints: III intermetallic compound growth kientics , 2001 .
[7] Fu Guo,et al. Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles , 2001 .
[8] Thirumany Sritharan,et al. Interface reaction between copper and molten tin–lead solders , 2001 .
[9] Z. P. Wang,et al. Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging , 2001 .
[10] J. Kivilahti,et al. Intermetallic reactions between lead-free SnAgCu solder and Ni(P)/Au surface finish on PWBs , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[11] Li Li,et al. Characterization of lead-free solders and under bump metallurgies for flip-chip package , 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
[12] Zhengkui Xu,et al. Thermal stability of electroless-nickel/solder interface: Part A. interfacial chemistry and microstructure , 2000 .
[13] R. Chromik,et al. Solder metallization interdiffusion in microelectronic interconnects , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
[14] D. R. Frear,et al. Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology , 1999 .
[15] Paul Harris,et al. The role of intermetallic compounds in lead‐free soldering , 1998 .
[16] Paul T. Vianco,et al. Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples , 1997 .
[17] P. Tu,et al. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints , 1997 .