Model of thermoelectric radiation sensors made by CMOS and micromachining

Abstract The feasibility of thermopile infrared detectors on CMOS silicon oxide cantilever beams isolated by post-processing anisotropic etching is assessed by an analytical model. The sensitivity and detectivity are calculated for a variety of device geometries. An optimal design with a predicted sensitivity of 20 V/W for a receiving area of 0.5 mm 2 is proposed.