Linewidth dependence of electromigration in evaporated Al‐0.5%Cu

The linewidth dependence of electromigration damage has been evaluated for 2.5‐cm‐long, 1–4‐μm‐wide, e‐gun‐evaporated Al‐0.5%Cu conductions. It is observed that the ≲1‐μm lines are much longer lived than the ≳2‐μm lines, reversing the trend at wider widths. These results are rationalized on the basis of the ’’bamboo’’‐type grain structure of narrow lines in contrast to the much more heterogeneous structure of the wider meanders.