论文信息 - Microstructure of a lead-free composite solder produced by an in-situ process

Microstructure of a lead-free composite solder produced by an in-situ process

A composite solder, which consisted of solder matrix and intermetallic reinforcements, was manufactured by an innovative method. The cast ingot of the Sn-6.9Cu-2.9Ag alloy has primary Cu6Sn5 intermetallics in dendritic form. After rolling, the intermetallic dendrites are crushed into fine particles and distributed uniformly in the solder matrix. The crushed intermetallic particles do not melt, and they retain their shape during spheroidizing and reflow because of their high melting temperature. Coarsening and gravitational segregation of the particles was observed during reflow and analyzed theoretically.

[1] J. L. Marshall,et al. Composite solders , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

[2] K. N. Subramanian,et al. Microstructural engineering of solders , 1999 .

[3] Dong Nyung Lee,et al. Use of thermodynamic data to calculate surface tension and viscosity of Sn-based soldering alloy systems , 2001 .

[4] Yong-Seog Kim,et al. Reflow characteristics of Sn-Ag matrix in-situ composite solders , 2000 .

[5] M. Mccormack,et al. Enhanced solder alloy performance by magnetic dispersions , 1994 .

[6] K. N. Subramanian,et al. Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging , 1999 .

[7] H. Betrabet,et al. Processing dispersion-strengthened SnPb solders to achieve microstructural refinement and stability , 1991 .

[8] Sungho Jin,et al. New, creep-resistant, low melting point solders with ultrafine oxide dispersions , 1998 .

[9] M. Chaturvedi,et al. Phase Transformation in Materials , 1991 .

[10] Sung K. Kang. Recent progress in Pb-free solders and soldering technologies , 2001 .

[11] G. H. Geiger,et al. Transport Phenomena in Materials Processing , 1998 .

[12] Hiroshi Ohtani,et al. Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys , 2000 .