Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
暂无分享,去创建一个
Fu Guo | Yongping Lei | Yaowu Shi | Xiaoyan Li | Zhidong Xia | Jianping Liu | Y. Lei | Yaowu Shi | Xiaoyan Li | Jianping Liu | Z. Xia | F. Guo | Y. Yan | Yanfu Yan
[1] Robert E. Reed-Hill,et al. Physical Metallurgy Principles , 1972 .
[2] J. Barnby,et al. Void nucleation during tensile deformation of a C-Mn structural steel , 1984 .
[3] H. Betrabet,et al. Processing dispersion-strengthened SnPb solders to achieve microstructural refinement and stability , 1991 .
[4] A. S. Nadkarni,et al. Void growth at ductile crack initiation of a structural steel , 1991 .
[5] J. L. Marshall,et al. Composite solders , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.
[6] Sungho Jin,et al. New, creep-resistant, low melting point solders with ultrafine oxide dispersions , 1998 .
[7] Fu Guo,et al. Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints , 2001 .
[8] Fu Guo,et al. Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles , 2001 .
[9] W. Wang,et al. Development of creep-resistant, nanosized Ag particle-reinforced Sn-Pb composite solders , 2004 .
[10] K. N. Subramanian,et al. Development of nano-composite lead-free electronic solders , 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
[11] F. Guo. Composite lead-free electronic solders , 2006 .
[12] J. Wei,et al. Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites , 2006 .