Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

Multi-layered printed circuit boards (PCBs) contain a multi-layered structure that is suitable for high-speed and high-frequency applications. Hence, they are used extensively in electronic packaging assemblies for high-density applications. However, numerous composite parts and complex material properties of multi-layer PCBs complicate the reliability simulation of PCB model. This paper deals with a finite element analysis intended to describe numerically the behavior of multi-layered multi-materials PCB model (combination of metallic and composite plies) in the drop-impact performance. Through the comparison of physical drop test results, the fully multi-layered model illustrates higher accuracy if compared with that of the traditional simplified isotropic model and orthotropic model. The effects of material properties for the multi-layer PCB under drop-impact shock have also been investigated.

[1]  Thomas D. Moore,et al.  The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly , 2002, Microelectron. Reliab..

[2]  K. H. Hoon,et al.  Initial global-local analysis for drop-impact effect study of TV products , 2004 .

[3]  H.L.J. Pang,et al.  Modeling and simulation of printed circuit board drop test , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

[4]  H. Ho.  A finite element analysis of the impact-contact problem of a portable telephone using I-DEAS and ADINA , 1995 .

[5]  Ray Ruichong Zhang,et al.  Vibration analysis of medical devices with a calibrated FEA model , 2002 .

[6]  C. Harris,et al.  Harris' Shock and Vibration Handbook , 1976 .

[7]  Fook Fah Yap,et al.  Vibration reliability characterization of PBGA assemblies , 2000 .

[8]  Kinuko Mishiro,et al.  Effect of the drop impact on BGA/CSP package reliability , 2002, Microelectron. Reliab..

[9]  Rao Tummala,et al.  Fundamentals of Microsystems Packaging , 2001 .

[10]  Daniel Coutellier,et al.  Multi-layered multi-material finite element for crashworthiness studies , 2000 .

[11]  Pranav Shrotriya,et al.  Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards , 2003 .

[12]  Nancy R. Sottos,et al.  Thermoelastic properties of plain weave composites for multilayer circuit board applications , 1999 .

[13]  John D. Whitcomb,et al.  Progressive Failure Behaviors of 2D Woven Composites , 2003 .

[14]  Clyde F. Coombs,et al.  Printed Circuits Handbook , 2007 .

[15]  Xinwei Zhang,et al.  Initial study on the drop-impact behavior of mini Hi-Fi audio products , 2001 .

[16]  Wataru Nakayama,et al.  Electronic Packaging: Design, Materials, Process, and Reliability , 1998 .

[17]  M. A. McCarthy,et al.  Numerical investigation of a crash test of a composite helicopter subfloor structure , 2001 .

[18]  M. Watanabe,et al.  Numerical Crashworthiness Simulation of Automotive Structures and Components Made of Continuous Fiber Reinforced Composite and Sandwich Assemblies , 1991 .

[19]  Mark I. Montrose.  Printed Circuit Board Basics , 2000 .