Non-chemically amplified resists for 193-nm immersion lithography: influence of absorbance on performance

The feasibility of three polymer systems for use as non chemically amplified resists for 193 nm lithography are discussed. The three systems are polycarbonates, polyphthalaldehydes and polysulfones. In general it was found that increased absorbance resulted in higher sensitivity to 193 nm light. However, the exception to this was the polycarbonates, which were found to undergo crosslinking due to an alkene group present in the polymer backbone. Although polyphthalaldehydes were very sensitive, their absorbance values were too high to be useful in a commercial environment. Absorbing polysulfones were found to be sensitive to 193 nm light and initial patterning results have been presented.

[1]  L. F. Thompson,et al.  Electron irradiation of poly(olefin sulfones). Application to electron beam resists , 1973 .

[2]  M. J. Bowden Radiation degradation of poly(2‐methylpentene‐1 sulfone) , 1974 .

[3]  Larry F. Thompson,et al.  Vapor development of poly(olefin sulfone) resists , 1974 .

[4]  J. P. Ballantyne,et al.  Poly(butene‐1 sulfone) —A highly sensitive positive resist , 1975 .

[5]  C. Willson,et al.  Approaches to the Design of Radiation‐Sensitive Polymeric Imaging Systems with Improved Sensitivity and Resolution , 1986 .

[6]  Hiroshi Ito,et al.  CHEMICAL AMPLIFICATION BASED ON ACID-CATALYZED DEPOLYMERIZATION , 1990 .

[7]  Hiroshi Ito,et al.  Aerial image contrast using interferometric lithography: effect on line-edge roughness , 1999, Advanced Lithography.

[8]  Roger H. French,et al.  Materials design and development of fluoropolymers for use as pellicles in 157-nm photolithography , 2001, SPIE Advanced Lithography.

[9]  Roderick R. Kunz,et al.  157-nm pellicles: polymer design for transparency and lifetime , 2002, SPIE Advanced Lithography.

[10]  Roger H. French,et al.  Novel hydrofluorocarbon polymers for use as pellicles in 157 nm semiconductor photolithography: fundamentals of transparency , 2003 .

[11]  Kenneth A. Goldberg,et al.  Extreme ultraviolet microexposures at the Advanced Light Source using the 0.3 numerical aperture micro-exposure tool optic , 2004 .

[12]  Willard E. Conley,et al.  Is ArF the final wavelength? , 2004, SPIE Advanced Lithography.

[13]  P. Kruit,et al.  Local critical dimension variation from shot-noise related line edge roughness , 2005 .

[14]  Hiroshi Ito Chemical amplification resists for microlithography , 2005 .

[15]  M. Stewart,et al.  Line edge roughness in chemically amplified resist: Speculation, simulation and application , 2005 .

[16]  Will Conley,et al.  High-RI resist polymers for 193 nm immersion lithography , 2005, SPIE Advanced Lithography.

[17]  Andrew K. Whittaker,et al.  XPS and 19F NMR Study of the Photodegradation at 157 nm of Photolithographic-Grade Teflon AF Thin Films , 2005 .

[18]  Yasin Ekinci,et al.  Characterization of extreme ultraviolet resists with interference lithography , 2006 .

[19]  Andrew K. Whittaker,et al.  Synthesis of high refractive index sulfur containing polymers for 193 nm immersion lithography: a progress report , 2006, SPIE Advanced Lithography.

[20]  Takahiro Kozawa,et al.  Correlation between proton dynamics and line edge roughness in chemically amplified resist for post-optical lithography , 2006 .

[21]  M. J. Bowden Factors affecting the sensitivity of positive electron resists , 2007 .

[22]  Paul Zimmerman,et al.  Status of High-Index Materials for Generation-Three 193nm Immersion Lithography , 2007 .

[23]  Will Conley,et al.  Novel high-index resists for 193-nm immersion lithography and beyond , 2007, SPIE Advanced Lithography.

[24]  Andrew K. Whittaker,et al.  The rational design of polymeric EUV resist materials by QSPR modelling , 2007, SPIE Advanced Lithography.

[25]  Andrew K. Whittaker,et al.  Mechanism of 157 nm Photodegradation of Poly[4,5-difluoro-2,2-bis(trifluoromethyl)-1,3-dioxole-co-tetrafluoroethylene] (Teflon AF) , 2007 .

[26]  Will Conley,et al.  Rational Design of High-RI Resists for 193nm Immersion Lithography , 2007 .

[27]  Karen Maex,et al.  Impact of line-edge roughness on resistance and capacitance of scaled interconnects , 2007 .

[28]  Takahiro Kozawa,et al.  Line edge roughness after development in a positive-tone chemically amplified resist of post-optical lithography investigated by Monte Carlo simulation and a dissolution model. , 2008, Nanotechnology.

[29]  Bryan J. Rice,et al.  Development of an operational high refractive index resist for 193nm immersion lithography , 2008, SPIE Advanced Lithography.

[30]  Takahiro Kozawa,et al.  Theoretical Study on Chemical Gradient Generated in Chemically Amplified Resists Based on Polymer Deprotection upon Exposure to Extreme Ultraviolet Radiation , 2009 .

[31]  Chris A. Mack,et al.  Polymer dissolution model: an energy adaptation of the critical ionization theory , 2009, Advanced Lithography.

[32]  R. French,et al.  Immersion Lithography: Photomask and Wafer-Level Materials , 2009 .

[33]  Andrew K. Whittaker,et al.  Development of polymers for non-CAR resists for EUV lithography , 2009, Advanced Lithography.

[34]  Takahiro Kozawa,et al.  Image Formation in Chemically Amplified Resists upon Exposure to Extreme Ultraviolet Radiation , 2009 .

[35]  Paul Zimmerman,et al.  Non-CA resists for 193 nm immersion lithography: effects of chemical structure on sensitivity , 2009, Advanced Lithography.

[36]  Takahiro Kozawa,et al.  Normalized Image Log Slope with Secondary Electron Migration Effect in Chemically Amplified Extreme Ultraviolet Resists , 2009 .

[37]  Yong Keng Goh,et al.  Polysulfone based non-CA resists for 193 nm immersion lithography: Effect of increasing polymer absorbance on sensitivity , 2011 .