Inkjet-printed 3D interconnects for millimeter-wave system-on-package solutions

This work outlines the development, fabrication, and measurement of fully inkjet-printed 3D interconnects for wireless mm-wave packaging solutions. Conductive silver nanoparticle and dielectric polymer-based inks are utilized to fabricate die attach, dielectric ramp, and CPW transmission line interconnect structures in order to interface a silicon die with a packaging substrate. Insertion and return loss are measured and compared with simulations over the range of 0-40 GHz. An inkjet-printed mm-wave bow-tie slot antenna is integrated with the IC die in order to highlight the highly versatile nature of this 3D interconnect technology for integration with emerging SoP technology.