Surface-energy triggered phase formation and epitaxy in nanometer-thick Ni1−xPtx silicide films

The formation of ultrathin silicide films of Ni1-xPtx at 450-850 degrees C is reported. Without Pt (x=0) and for t(Ni)= 4 nm, polycrystalline NiSi films form and agglomerate at lower temperatures f ...

[1]  C. Detavernier,et al.  Pt redistribution during Ni"Pt… silicide formation , 2008 .

[2]  C. Vrancken,et al.  Systematic TLM Measurements of NiSi and PtSi Specific Contact Resistance to n- and p-Type Si in a Broad Doping Range , 2008, IEEE Electron Device Letters.

[3]  Y. Nishi,et al.  Handbook of Semiconductor Manufacturing Technology , 2007 .

[4]  Shi-Li Zhang,et al.  Self-aligned silicides for Ohmic contacts in complementary metal–oxide–semiconductor technology: TiSi2, CoSi2, and NiSi , 2004 .

[5]  Shi-Li Zhang,et al.  Metal Silicides in CMOS Technology: Past, Present, and Future Trends , 2003 .

[6]  S. K. Lahiri,et al.  Enhancement of thermal stability of NiSi films on (100)Si and (111)Si by Pt addition , 1999 .

[7]  U. Schärer,et al.  Competitive metastable phase in low-temperature epitaxy of CoSi 2 /Si(111) , 1997 .

[8]  F. d'Heurle,et al.  On the formation of epitaxial CoSi2 from the reaction of Si with a Co/Ti bilayer , 1995 .

[9]  F. D. Boer Cohesion in Metals: Transition Metal Alloys , 1989 .

[10]  Tung,et al.  Origin of A- or B-type NiSii2 determined by in in situ transmission electron microscopy and diffraction during growth. , 1988, Physical review letters.

[11]  F. d'Heurle,et al.  Kinetics of formation of silicides: A review , 1986 .

[12]  J. Poate,et al.  Growth of single crystal epitaxial silicides on silicon by the use of template layers , 1983 .

[13]  Pooi See Lee,et al.  Micro-Raman spectroscopy investigation of nickel silicides and nickel (platinum) silicides , 1999 .

[14]  James L Erskine,et al.  Diffusion layers and the Schottky-barrier height in nickel silicide-silicon interfaces , 1983 .