Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints

[1]  A. Jalar,et al.  Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process , 2014 .

[2]  P. Mach,et al.  Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach , 2014 .

[3]  P. Mach,et al.  Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach , 2014, Arabian Journal for Science and Engineering.

[4]  B. Saatçi,et al.  Thermal, Electrical, Microstructure and Microhardness Properties of the Eutectic Magnesium–Tin , 2014 .

[5]  Mohd Zulkifly Abdullah,et al.  Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process , 2012 .

[6]  L. Snugovsky,et al.  'Spalling' of SAC Pb free solders when used with nickel substrates , 2009 .

[7]  C. Kao,et al.  Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element , 2007 .

[8]  C. Kao,et al.  Interfacial reaction issues for lead-free electronic solders , 2006 .

[9]  L. Snugovsky,et al.  Phase equilibria in Sn rich corner of Cu–Ni–Sn system , 2006 .

[10]  Wang Mingxiang,et al.  A comprehensive finite element model for simulating reflow profile of a BGA package , 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..

[11]  C. Kao,et al.  Effects of limited cu supply on soldering reactions between SnAgCu and Ni , 2006 .

[12]  Sung K. Kang,et al.  Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization , 2004 .

[13]  Johan Liu,et al.  Comparison of isothermal mechanical fatigue properties of lead free solder joints and bulk solders , 2005, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

[14]  Jorge E. Gonzalez,et al.  Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens , 2003 .

[15]  Sinn-wen Chen,et al.  Phase equilibria and solidification properties of Sn-Cu-Ni alloys , 2002 .

[16]  King-Ning Tu,et al.  Reliability issues of Pb-free solder joints in electronic packaging technology , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[17]  Sung Yi,et al.  Solder ball failure mechanisms in plastic ball grid array packages , 2002 .

[18]  K. Tu,et al.  Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .

[19]  Y. L. Lin,et al.  Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni , 2002 .

[20]  C. Handwerker,et al.  Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys , 2000 .

[21]  I. Hui,et al.  An alternative approach for the analysis of intermetallic compounds in SMT solder joints , 2000 .

[22]  Morris E. Fine,et al.  Tin-silver-copper eutectic temperature and composition , 2000 .

[23]  Sung Yi,et al.  Solder joint reliability of plastic ball grid array packages , 1999 .

[24]  C. J. Thwaites,et al.  Some Metallurgical Studies Related to the Surface Mounting of Electronic Components , 1984 .