Development and Application of Molded Interconnect Devices

With the improvements of electromechanical systems’ automation and intelligence, contradiction between the high integration, high performance and miniaturization, low cost has become the principal reason restricting the development of electromechanical system. The emergence of molded interconnection device (MID) technology provides a new way to resolve this contradiction. Integration of the mechanical and electrical functions in electromechanical system onto the same polymer molded base structure, replacement of the tradition printed circuit board (PCB), design and processing of 3D circuit system on polymer molded base structure surface distinguishes MID technology from others. MID technology can not only save space occupied by the electromechanical system and improve the system integration, but also can simplify the assembly process and lower the cost. In this study, present research and future development of MID technology were introduced first. Then the main technical problems involved in MID processing including the design method of MID, materials technology, equipment technology, surface mounted devices (SMD) assembly technique, and so on were analyzed systematically. Finally, using the ultrasonic micro embossing technology, a manufacturing method of polymer circuit board, radio frequency identification (RFID) antenna, microelectrode arrays, and some other polymer foil MID was proposed. Based on the in-depth analysis of polymer foil MID’s characteristics, polymer foil MID are expected to have a broad application in the field of microfluidic chip. Development and Application of Molded Interconnect Devices

[1]  X. Huang,et al.  Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate , 2004 .

[2]  W. Schomburg,et al.  Fabrication of Molded Interconnection Devices by Ultrasonic Hot Embossing on Thin Polymer Films , 2009, IEEE Transactions on Electronics Packaging Manufacturing.

[3]  S. Krimi,et al.  Alternative Placement Systems for Three-Dimensional Circuit Boards , 1998 .

[4]  Plastic deformation of solderless press-fit connectors , 2007 .

[5]  Christof Gerhardy,et al.  Ultrasonic Hot Embossing , 2011, Micromachines.

[6]  Rudolf Wiechmann,et al.  Experiences with peel strength , 2006 .

[7]  W. Schomburg,et al.  Fabrication of polymer micro devices by ultrasonic hot embossing , 2008 .

[8]  K. Feldmann,et al.  Analytical and Experimental Research on Assembly Systems for Molded Interconnection Devices (3D-MID) , 1994 .

[9]  Hans Nørgaard Hansen,et al.  Process chains for the manufacturing of molded interconnect devices , 2009 .

[10]  Xiaolei Du,et al.  Three-dimensional automatic routing for the design of moulded interconnect devices , 2011, Int. J. Comput. Integr. Manuf..

[11]  Peter T. Tang,et al.  Selective metallization of polymers using laser induced surface activation (LISA)—characterization and optimization of porous surface topography , 2011 .

[12]  Matthias Worgull,et al.  Hot Embossing: Theory and Technology of Microreplication , 2009 .

[13]  Nouhad Bachnak.  3D-MID technology MEMS connectivity at system level , 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

[14]  N. Geren,et al.  Solder Paste Dispensing in Robotic SMD Rework , 1994 .

[15]  H. Reichl,et al.  Duromer MID technology for system-in-package generation , 2005, IEEE Transactions on Electronics Packaging Manufacturing.

[16]  A. Kilian,et al.  Investigation of the Hot Embossing Technology for Low-Cost Antennas Printed on Polymer Substrates , 2008, 2008 38th European Microwave Conference.

[17]  Thomas Frick,et al.  A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology , 2010 .