Laser Dicing Of Silicon Wafer
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Jerry Y. H. Fuh | H. T. Loh | Y. S. Wong | Y. Wong | H. Loh | J. Fuh | Y. Tang | Y. Tang | Y. K. Lim
[1] Christopher J. Sutcliffe,et al. Micromachining of copper using Nd:YAG laser radiation at 1064, 532, and 355 nm wavelengths , 2001 .
[2] Erdan Gu,et al. Micromachining and dicing of sapphire, gallium nitride and micro LED devices with UV copper vapour laser , 2003 .
[3] G. Chryssolouris. Laser Machining: Theory and Practice , 1991 .
[4] Chwan-Huei Tsai,et al. Applying an On-line Crack Detection Technique For Laser Cutting by Controlled Fracture , 2001 .
[5] I. Black,et al. A laser beam machining (LBM) database for the cutting of ceramic tile , 1998 .
[6] Dieter Schuöcker,et al. High Power Lasers in Production Engineering , 1999 .
[7] V. Kripesh,et al. Effect of Nd:YAG laser micromachining on gold conductor printed over ceramic substrates , 2000 .