Time-resolved investigation of pulsed-DC magnetron reactive plasma

Summary form only given, as follows. DC reactive sputter deposition of dielectric films can be greatly affected by arcing. Observations have indicated that arcing is due to breakdown of the dielectric (oxide) film, which grows on the surface of the metal target as a result of positive charge accumulation. The use of pulsed-DC power in the pulsing frequency range of 20-350 kHz has been employed to reduce or eliminate arcing. Using duty cycles, which could be varied between 50% and 90%, plasma dynamics were studied. The relationships between various deposition process parameters (power, pressure, pulsing frequency, duty cycle, etc.) were studied using time-resolved general electrical, Langmuir probe and optical emission measurement techniques and the results are discussed.