Bounded skew clock routing for 3D stacked IC designs: Enabling trade-offs between power and clock skew
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[1] Xin Zhao,et al. Buffered clock tree synthesis for 3D ICs under thermal variations , 2008, 2008 Asia and South Pacific Design Automation Conference.
[2] Eby G. Friedman,et al. Clock distribution networks for 3-D ictegrated Circuits , 2008, 2008 IEEE Custom Integrated Circuits Conference.
[3] Taewhan Kim,et al. Clock tree embedding for 3D ICs , 2010, 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC).
[4] Hsien-Hsin S. Lee,et al. Pre-bond testable low-power clock tree design for 3D stacked ICs , 2009, 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers.
[5] Narayanan Vijaykrishnan,et al. Thermally Robust Clocking Schemes for 3D Integrated Circuits , 2007, 2007 Design, Automation & Test in Europe Conference & Exhibition.
[6] Xin Zhao,et al. Power and slew-aware clock network design for through-silicon-via (TSV) based 3D ICs , 2010, 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC).
[7] Jason Cong,et al. Bounded-skew clock and Steiner routing , 1998, TODE.
[8] Ren-Song Tsay,et al. An exact zero-skew clock routing algorithm , 1993, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[9] Wayne P. Burleson,et al. Low-power clock distribution in a multilayer core 3d microprocessor , 2008, GLSVLSI '08.
[10] Taewhan Kim,et al. Clock tree synthesis with pre-bond testability for 3D stacked IC Designs , 2010, Design Automation Conference.