High-level simulation of substrate noise in high-ohmic substrates with interconnect and supply effects

Substrate noise is a major obstacle for mixed-signal integration. In this paper we propose a fast and accurate high-level methodology to simulate substrate noise generated by large digital circuits. The methodology can handle any substrate type, e.g. bulk-type or EPI-type, and takes into account the effects of interconnect and supply. For each standard cell a substrate macromodel is used in order to efficiently simulate the total system, which consists of a network of such macromodels. For a 40K gates telecom circuit fabricated in a 0.18 mm CMOS process, measurements indicate that substrate noise is simulated by using our methodology within 20% error but several orders of magnitude faster in CPU time than a full SPICE simulation..

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