论文信息 - Reliability Assessment on Insertion Mount Assembly under Vibration Conditions

Reliability Assessment on Insertion Mount Assembly under Vibration Conditions

This paper presents the reliability design-of-experiment and results for an insertion-mount assembly under random vibration loading conditions. The natural frequency and overstress limits were first identified for the test vehicle. The durability of assemblies with Sn37Pb (SnPb) and Sn3.0Ag0.5Cu (SAC) solder joints was compared under aging conditions that vary on temperature and duration: 125degC for 100 hours, 125degC for 350 hours, -55degC for 1000 hours. The effects of aging and printed circuit board pad finishes on solder joint reliability were also investigated. The results show that SnPb solder joints have better performance than SAC solder joints, especially under high-vibration loading conditions and with thermal aging treatment. Pad finishes were also found to contribute to diffusion in assembly reliability but with different trends for differently aged products.

[1] J. Seyyedi. Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly , 1993 .

[2] C. Basaran,et al. Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading , 2002 .

[3] Michael Pecht,et al. Lead-free Electronics , 2006 .

[4] Michael Pecht,et al. Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards , 1999 .

[5] P. Vianco. An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance , 1999 .

[6] M. Pecht,et al. Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach , 1990 .

[7] Michael Osterman,et al. Remaining life assessment of aging electronics in avionic applications , 2003, Annual Reliability and Maintainability Symposium, 2003..