In-process thin film thickness measurement and control
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An in-situ ellipsometer was used to provide real-time thickness measurements and control of process end point during plasma etching of silicon dioxide. In-situ ellipsometer thickness values were obtained at intervals of 0.15 seconds. The measured thickness was used to determine end point to obtain a desired film thickness. The oxide films etched using in-process ellipsometer control had a thickness accuracy and reproducibility of 3 A. In comparison, timed etching of silicon dioxide films in the same reactor, a thickness reproducibility of only 69 A was obtained.
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