Optoelectronic Glass Substrates for Co-Packaging of Optics and ASICs

A glass packaging substrate with integrated waveguides and evanescent couplers for silicon photonic chiplets is introduced for fiber to chip interconnects with high-channel counts required for co-packaging of optics and switch ASICs in next-generation datacenters.

[1]  Javier Ayala,et al.  300-mm Monolithic Silicon Photonics Foundry Technology , 2019, IEEE Journal of Selected Topics in Quantum Electronics.

[2]  Ashok V. Krishnamoorthy,et al.  From Chip to Cloud: Optical Interconnects in Engineered Systems , 2017, Journal of Lightwave Technology.

[3]  Tymon Barwicz,et al.  Integrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing , 2019, IEEE Journal of Selected Topics in Quantum Electronics.

[4]  Li Chen,et al.  Silicon photonics coherent transceiver in a ball-grid array package , 2017, 2017 Optical Fiber Communications Conference and Exhibition (OFC).

[5]  Ali Ghiasi,et al.  Large data centers interconnect bottlenecks. , 2015, Optics express.

[6]  Christian Baks,et al.  Organic Multi-Chip Module for high performance systems , 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

[7]  Jinfeng Mu,et al.  Design and length optimization of an adiabatic coupler for on-chip vertical integration of rare-earth-doped double tungstate waveguide amplifiers , 2014, 2014 16th International Conference on Transparent Optical Networks (ICTON).