A Microscopic Multi-view Based Workeell for Wafer-level Microassembling

This paper reports on a workcell developed for microfluidic chip alignment and microassembly operations in volume MEMS devices production. The workcell consists of a 6-DOF (degree of freedom) high precision positioning unit, a split-field imaging unit, an auxiliary unit, and a control software unit. A multi-view microscopic vision unit is employed to achieve levelling compensation and observe two pairs of alignment keys. Zooming, focusing and illuminating of the optics can be adjusted automatically through image analysis to bring the alignment keys into view with high-level image quality. Face-to-face alignment movements are driven by the 6-DOF precision positioning unit. Experimental results show that the microassembly accuracy of the workcell can reach 2.1 mum.

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