On the design of debond-resistant bimaterials: Part II: A comparison of free-edge and interface crack approaches

Abstract In Part I of this paper, the authors have adopted a fracture mechanics-type approach to characterize the intensity of the free-edge stress singularity governing initiation of debonding for the general plane elasticity problem of a bimaterial strip under uniform edge loadings. In this study, the same global problem configuration is used to provide an extensive comparison between the free-edge singularity and interface crack approaches to bimaterial design. While similar trends in the intensities of the free-edge and interface crack singularities are shown to be largely governed by trends in the global interface stress resultants, fundamental differences in the local singular fields are shown in some cases to result in competing design implications. As a result, design guidelines are provided with respect to both free-edge debonding and steady-state interface crack extension over a wide range of practical material properties and relative layer thicknesses. Finally, the methods discussed herein are applied to a four-layer bimaterial configuration, for which the three interfaces are compared with respect to both free-edge debonding and subsequent interface crack extension over a wide range of elastic mismatches.

[1]  D. Munz,et al.  Stress singularities in a dissimilar materials joint with edge tractions under mechanical and thermal loadings , 1997 .

[2]  D. Munz,et al.  The Stress Intensity Factor in Bonded Quarter Planes after a Change in Temperature , 1995 .

[3]  K. Liechti,et al.  The intrinsic toughness and adhesion mechanisms of a glass/epoxy interface , 1999 .

[4]  A. Evans,et al.  On the decohesion of residually stressed thin films , 1988 .

[5]  J. Beuth,et al.  Axisymmetric delamination in deposited multi-layers , 1997 .

[6]  J. Dundurs,et al.  Discussion of Edge-Bonded Dissimilar Orthogonal Elastic Wedges under Normal and Shear Loading , 1969 .

[7]  Z. Suo,et al.  Interface crack between two elastic layers , 1990 .

[8]  T. Fett,et al.  The regular stress term in bonded dissimilar materials after a change in temperature , 1993 .

[9]  T. Hattori,et al.  A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices , 1989 .

[10]  J. Dundurs.  Discussion: ``Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading'' (Bogy, D. B., 1968, ASME J. Appl. Mech., 35, pp. 460-466) , 1969 .

[11]  A. Gradin,et al.  A Fracture Criterion for Edge-Bonded Bimaterial Bodies , 1982 .

[12]  E. D. Reedy,et al.  Intensity of the stress singularity at the interface corner between a bonded elastic and rigid layer , 1990 .

[13]  Norman A. Fleck,et al.  Interfacial cracking from the freeedge of a long bi-material strip , 1997 .

[14]  David B. Bogy,et al.  Two Edge-Bonded Elastic Wedges of Different Materials and Wedge Angles Under Surface Tractions , 1971 .

[15]  A. Evans,et al.  The cracking and decohesion of thin films , 1988 .

[16]  James R. Rice,et al.  Elastic Fracture Mechanics Concepts for Interfacial Cracks , 1988 .

[17]  J. Beuth,et al.  On the design of debond-resistant bimaterials , 2000 .

[18]  S. Schmauder,et al.  Composite Parameters and Mechanical Compatibility of Material Joints , 1988 .

[19]  J. L. Beuth,et al.  Residual stress-driven delamination in deposited multi-layers , 1996 .

[20]  N. J. Pagano,et al.  Some Observations on the Interlaminar Strength of Composite Laminates , 1973 .

[21]  D. Munz,et al.  Stress Singularities at the Interface in Bonded Dissimilar Materials Under Mechanical and Thermal Loading , 1992 .

[22]  David B. Bogy,et al.  On the problem of edge-bonded elastic quarter-planes loaded at the boundary , 1970 .

[23]  David B. Bogy,et al.  Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading , 1968 .

[24]  F. Erdogan,et al.  Stress singularities in a two-material wedge , 1971 .

[25]  Z. Suo,et al.  Mixed mode cracking in layered materials , 1991 .