Thermal transient test based thermal structure function analysis of IGBT package

The heat flow distribution in IGBT package is significantly affected by its interfacing materials and dimension of metal frame. In order to increase heat-sink capability which is critical for kW IGBT device, lateral heat spreading technology is introduced. To design in such 3D heat flux structure in real power device package, accurate thermal distribution analysis is required. Using three dimensional thermal CFD simulators is proven to be valid for thermal structural analysis, however in most of practical cases material properties like thermal conductivity or contact thermal resistance are always unknown. In this paper we are going show the possibility of utilizing thermal transient test and thermal structure function based approach to analyze thermal characteristic and heat flux in a real IGBT package.