A Study of Solder Joint Failure Criteria

One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system. Cross-sectioning and scanning electron microscopy (SEM) is a destructive method. A common non-destructive test method is to monitor resistance increase in a solder joint or a daisy-chain. However, no scientific research has been done in establishing the relationship between the crack area of an interconnection and the change in resistance of the interconnection. This paper proposes a method of defining failure criteria as the resistance increase in a solder joint exceeding a threshold. The threshold is determined by k times the range over the natural variation in resistance measured by a measurement system. The natural variation by random cause is judged using X-bar and R charts. The principles of defining failure criteria are to be able to detect failure of solder joints a...

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