Electrochemical Grooving of Si Wafers Using Catalytic Wire Electrodes in HF Solution
暂无分享,去创建一个
Michio Matsumura | Takeshi Hirai | Chia-Lung Lee | Shigeru Ikeda | Yuji Kanda | S. Ikeda | M. Matsumura | Chia-Lung Lee | T. Hirai | Y. Kanda
[1] Michio Matsumura,et al. Morphology of nanoholes formed in silicon by wet etching in solutions containing HF and H2O2 at different concentrations using silver nanoparticles as catalysts , 2007 .
[2] Volker Lehmann,et al. Electrochemistry of Silicon , 2002 .
[3] Hans Joachim Möller,et al. Wafering of silicon crystals , 2006 .
[4] S. Ikeda,et al. Pore formation in silicon by wet etching using micrometre-sized metal particles as catalysts , 2008 .
[5] K. Tsujino,et al. Boring Deep Cylindrical Nanoholes in Silicon Using Silver Nanoparticles as a Catalyst , 2005 .
[6] W. König,et al. Wafer slicing by internal diameter sawing , 1988 .
[7] Hans Joachim Möller,et al. Basic Mechanisms and Models of Multi‐Wire Sawing , 2004 .
[8] Michio Matsumura,et al. Helical Nanoholes Bored in Silicon by Wet Chemical Etching Using Platinum Nanoparticles as Catalyst , 2005 .
[9] Yunjie Yan,et al. Dendrite‐Assisted Growth of Silicon Nanowires in Electroless Metal Deposition , 2003 .
[10] P. Allongue,et al. Electrochemical micromachining of p-type silicon , 2004 .
[11] Shinji Yae,et al. Formation of porous silicon by metal particle enhanced chemical etching in HF solution and its application for efficient solar cells , 2003 .