Electrical Characterization of the through Via in P ackage-on- Package with Interposer using Parameter Extraction Method

This paper describes a method to extract electrical parameters of the through via in Package-on-Package (PoP) with interposer. Using the de-embedding technique electrical parameters of the through via are extracted. With the extracted elect rical parameters of the through via, the effects of via h eight, the distance between signal and GND vias, and anti-pad clearance on the electrical characteristics are dis cussed.