Modeling and characterization of a silicon condenser microphone

A single-chip silicon condenser microphone with a single deeply corrugated diaphragm (SDCD) has been developed. The fundamental characteristics, including mechanical sensitivity, resonance frequency, zero-pressure offset and temperature dependence of the diaphragm, are simulated using a finite element model (FEM). An analytical model is presented to validate that the higher mechanical sensitivity of the SDCD compared with the flat diaphragm with clamped edges is achieved by both releasing the residual stress and reducing the effective mechanical constant of the diaphragm structure. The electrostatic–structural coupling FEM analysis is used in combination with equivalent circuits to evaluate and understand the mechanical, electrostatic and acoustic performances of the microphone. The measurements show reasonable agreements with the theoretical predictions.

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