Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation

In this work layered copper films with smooth surface were successfully fabricated onto ITO substrate by electrochemical deposition (ECD) and the thickness of the films was nearly 60 nm. The resulting films were characterized by SEM, TEM, AFM, XPS, and XRD. We have investigated the effects of potential and the concentration of additives and found that 2D dendritic-like growth process leaded the formation of films. A suitable growth mechanism based on diffusion limited aggregation (DLA) mechanism for the copper films formation is presented, which are meaningful for further designing homogeneous and functional films.

[1]  J. Tu,et al.  Electrodeposition, structural, and corrosion properties of Cu films from a stable deep eutectics system with additive of ethylene diamine , 2012 .

[2]  Qiming Liu,et al.  Synthesis of silver nanostructures by simple redox under electrodeposited copper microcubes and the orient attachment growth of 2D silver , 2015 .

[3]  Sung-Hwan Han,et al.  Growth of silver dendritic nanostructuresvia electrochemical route , 2012 .

[4]  R. Rangel,et al.  Montecarlo DLA-type simulations of wetting effects in fluid displacement in porous media , 2009 .

[5]  E. Brener,et al.  Pattern selection in two-dimensional dendritic growth , 1991 .

[6]  R. Nuzzo,et al.  Physical and spectroscopic studies of the nucleation and growth of copper thin films on polyimide surfaces by chemical vapor deposition , 1995 .

[7]  P. Kohl,et al.  The Deposition Characteristics of Accelerated Nonformaldehyde Electroless Copper Plating , 2003 .

[8]  K. Kern,et al.  Mechanism of the transition from fractal to dendritic growth of surface aggregates , 1994, Nature.

[9]  A. Hubin,et al.  A generalized electrochemical aggregative growth mechanism. , 2013, Journal of the American Chemical Society.

[10]  W. Tillmann,et al.  Preliminary Investigation on Brazing Performance of Ti/Ti and Ti/Steel Joints Using Copper Film Deposited by PVD Technique , 2012, Journal of Materials Engineering and Performance.

[11]  Xin Zhang,et al.  Shape control of electrodeposited copper films and nanostructures through additive effects. , 2014, Langmuir : the ACS journal of surfaces and colloids.

[12]  Hyun-Jun Hwang,et al.  Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics , 2014, Nanotechnology.

[13]  Wong,et al.  Nonlinear oscillations in electrochemical growth of Zn dendrites. , 1989, Physical Review B (Condensed Matter).

[14]  Darrick J. Williams,et al.  Conducting Polymer-Based Electrodeless Deposition of Pt Nanoparticles and Its Catalytic Properties for Regioselective Hydrosilylation Reactions , 2009 .

[15]  Ilsoo Kim,et al.  Growth of Silicon Nanosheets Under Diffusion-Limited Aggregation Environments , 2015, Nanoscale Research Letters.

[16]  M. Lei,et al.  On the pressure effect in energetic deposition of Cu thin films by modulated pulsed power magnetron sputtering: A global plasma model and experiments , 2015 .

[17]  A. Czanderna,et al.  Ion scattering and X-ray photoelectron spectroscopy of copper overlayers vacuum deposited onto mercaptohexadecanoic acid self-assembled monolayers , 2000 .

[18]  J. Perry,et al.  Layer‐By‐Layer Dendritic Growth of Hyperbranched Thin Films for Surface Sol–Gel Syntheses of Conformal, Functional, Nanocrystalline Oxide Coatings on Complex 3D (Bio)silica Templates , 2009 .

[19]  M. C. Cassani,et al.  Simple one step electrochemical preparation of copper nanostructures , 2014 .

[20]  P. Searson,et al.  On the influence of the nucleation overpotential on island growth in electrodeposition , 2010 .

[21]  U. Bach,et al.  Light-driven transformation processes of anisotropic silver nanoparticles. , 2013, ACS nano.

[22]  M. Hsieh,et al.  Studies of single-step electrodeposition of CuInSe2 thin films with sodium citrate as a complexing agent , 2010 .

[23]  Stephen A. Morin,et al.  Screw dislocation-driven growth of two-dimensional nanoplates. , 2011, Nano letters.