论文信息 - Enhancing Fracture Conductivity Through Surface Modification of Proppant - 字舞流文

Enhancing Fracture Conductivity Through Surface Modification of Proppant

Brahmadeo T. Dewprashad | Jim D. Weaver | Mark A. Parker | John M. Terracina | P. D. Nguyen | M. Parker | Phillip D. Nguyen | J. Weaver | B. Dewprashad | J. Terracina