Computational optimization of counter-flow double-layered microchannel heat sinks subjected to thermal resistance and pumping power

Various microchannel heat sinks are widely used to cool electronic chips, but they are often designed to be single-layer channels. To a certain extent, single-layered microchannel heat sinks can solve the problem of high heat flux. However, due to the limitation of pumping power, only a small coolant flow rate can be adopted; and the temperature of the heated plate is non-uniform. In this paper, the structure of double-layered countercurrent microchannel heat sinks is designed. The NSGA-II optimization algorithm is used to optimize the height ratio of the two layers and the length of the upper layer. The corresponding Pareto frontier is obtained. After validation of the optimization Pareto front, some validated characteristic cases are investigated numerically. The results of the optimization show that despite a conflict between reducing the thermal resistance and lowering the pumping power, there is an appropriate structure of the double-layered countercurrent microchannel heat sink optimized by the NSGA-II optimization algorithm. For the selected cases, Case 4 has the best thermal performance, because Case 4 not only has a smaller pumping power than Case 0, but also has a smaller thermal resistance than Case 0. Therefore, it is indicated that better thermal performance of microchannel heat sinks can be achieved through the optimization algorithm.

[1]  Chin‐Hsiang Cheng,et al.  An inverse geometry design problem for optimization of single serpentine flow field of PEM fuel cell , 2010 .

[2]  K. Vafai,et al.  Analysis of two-layered micro-channel heat sink concept in electronic cooling , 1999 .

[3]  Kun Xu,et al.  Multiple temperature kinetic model and its applications to micro-scale gas flows , 2012 .

[4]  A. Rezania,et al.  Experimental investigation of thermoelectric power generation versus coolant pumping power in a microchannel heat sink , 2012 .

[5]  Xu Jinliang,et al.  Optimal geometric structure for nanofluid-cooled microchannel heat sink under various constraint conditions , 2013 .

[6]  Xiao-dong Wang,et al.  An improved design of double-layered microchannel heat sink with truncated top channels , 2015 .

[7]  Duu-Jong Lee,et al.  Inverse geometric optimization for geometry of nanofluid-cooled microchannel heat sink , 2013 .

[8]  Habib Aminfar,et al.  Numerical investigation of forced convection heat transfer through microchannels with non-Newtonian nanofluids , 2014 .

[9]  S. Garimella,et al.  Thermally Developing Flow and Heat Transfer in Rectangular Microchannels of Different Aspect Ratios , 2006 .

[10]  Goodarz Ahmadi,et al.  Numerical study of heat transfer performance of single-phase heat sinks with micro pin-fin structures , 2013 .

[11]  Eckart Zitzler,et al.  Evolutionary algorithms for multiobjective optimization: methods and applications , 1999 .

[12]  Wenjing Ye,et al.  Theoretical and Numerical Studies of Noncontinuum Gas-Phase Heat Conduction in Micro/Nano Devices , 2010 .

[13]  W. Yan,et al.  Analysis of heat transfer characteristics of double-layered microchannel heat sink , 2012 .

[14]  Duu-Jong Lee,et al.  Flow field optimization for proton exchange membrane fuel cells with varying channel heights and widths , 2009 .

[15]  Tiantian Zhang,et al.  Combined Experimental and Numerical Study for a Multiple-Microchannel Heat Transfer System , 2013 .

[16]  Roy W. Knight,et al.  Optimal Thermal Design of Forced Convection Heat Sinks-Analytical , 1991 .

[17]  Gongnan Xie,et al.  Numerical Predictions of the Flow and Thermal Performance of Water-Cooled Single-Layer and Double-Layer Wavy Microchannel Heat Sinks , 2013 .

[18]  Josua P. Meyer,et al.  Geometric Optimisation of Multi-Layered Microchannel Heat Sink with Different Flow Arrangements , 2014 .

[19]  Ya-Ling He,et al.  Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink , 2009 .

[20]  Yogesh Jaluria,et al.  Designs of multiple microchannel heat transfer systems , 2011 .

[21]  S. Kandlikar,et al.  Extending the heat flux limit with enhanced microchannels in direct single-phase cooling of computer chips , 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

[22]  R. Pease,et al.  High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[23]  Manu Mital,et al.  Analytical analysis of heat transfer and pumping power of laminar nanofluid developing flow in microchannels , 2013 .

[24]  Wen-Quan Tao,et al.  Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink , 2007 .

[25]  Gongnan Xie,et al.  Comparative Study of the Flow and Thermal Performance of Liquid-Cooling Parallel-Flow and Counter-Flow Double-Layer Wavy Microchannel Heat Sinks , 2013 .

[26]  R. Webb,et al.  Forced convection heat transfer in helically rib-roughened tubes , 1980 .

[27]  Chia-Pin Chiu,et al.  Cooling a Microprocessor Chip , 2006, Proceedings of the IEEE.

[28]  S. Garimella,et al.  Investigation of heat transfer in rectangular microchannels , 2005 .

[29]  Scott J. Ormiston,et al.  Three-dimensional analysis of fluid flow and heat transfer in single- and two-layered micro-channel heat sinks , 2011 .

[30]  W. Yan,et al.  Multi-parameter optimization of flow and heat transfer for a novel double-layered microchannel heat sink , 2015 .