Investigation of copper-tin transient liquid phase bonding reliability for 3D integration
暂无分享,去创建一个
R. Franiatte | R. Anciant | S. Cheramy | D. Bouchu | A. Garnier | R. Anciant | S. Chéramy | D. Bouchu | R. Franiatte | C. Gremion | A. Garnier | C. Gremion
[1] Kaiying Wang,et al. Wafer-Level Cu/Sn to Cu/Sn SLID-Bonded Interconnects With Increased Strength , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[2] Jung-Hyun Song,et al. Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications , 2011 .
[3] P. Cochat,et al. Et al , 2008, Archives de pediatrie : organe officiel de la Societe francaise de pediatrie.
[4] Nils Hoivik,et al. Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging , 2010, 3rd Electronics System Integration Technology Conference ESTC.
[5] W. Gust,et al. Intermetallic phase formation in thin solid-liquid diffusion couples , 1994 .
[6] Tao-Chih Chang,et al. Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[7] D. C. Yeh,et al. Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin , 1984 .
[8] Jin Yu,et al. Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering , 2008 .
[9] W. Ruythooren,et al. Characterization of oxidation of electroplated sn for advanced flip-chip bonding , 2009, 2009 European Microelectronics and Packaging Conference.
[10] Chih Chen,et al. Electromigration in Sn–Cu intermetallic compounds , 2009 .
[11] Paresh Limaye,et al. Cu/Sn microbumps interconnect for 3D TSV chip stacking , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
[12] D. Temple,et al. High Density Metal–Metal Interconnect Bonding for 3-D Integration , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[13] H. Hieber,et al. Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems , 1995 .
[14] P. Soussan,et al. Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections , 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).