Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations
暂无分享,去创建一个
Rong An | Huaping Wu | Yanhong Tian | Chunqing Wang | Yanhong Tian | R. An | Huaping Wu | Chunqing Wang
[1] K. Tu,et al. Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .
[2] A. Zunger,et al. Self-interaction correction to density-functional approximations for many-electron systems , 1981 .
[3] H. Monkhorst,et al. SPECIAL POINTS FOR BRILLOUIN-ZONE INTEGRATIONS , 1976 .
[4] Richard P. Vinci,et al. Nanoindentation measurements on Cu–Sn and Ag–Sn intermetallics formed in Pb-free solder joints , 2003 .
[5] Graeme Ackland,et al. Structure and elasticity of MgO at high pressure , 1997 .
[6] M. Asta,et al. Phase stability, phase transformations, and elastic properties of Cu_6Sn_5: Ab initio calculations and experimental results , 2005 .
[7] Matt Probert,et al. First-principles simulation: ideas, illustrations and the CASTEP code , 2002 .
[8] David J. Singh,et al. Properties of ordered intermetallic alloys: first-principles and approximate methods , 1993 .
[9] R. Hill. The Elastic Behaviour of a Crystalline Aggregate , 1952 .
[10] Y. C. Chan,et al. Reliability studies /spl mu/BGA solder joints-effect of Ni-Sn intermetallic compound , 2001 .
[11] Jan Almlöf,et al. General methods for geometry and wave function optimization , 1992 .
[12] D. Vanderbilt,et al. Soft self-consistent pseudopotentials in a generalized eigenvalue formalism. , 1990, Physical review. B, Condensed matter.
[13] Klein,et al. Structural properties of ordered high-melting-temperature intermetallic alloys from first-principles total-energy calculations. , 1990, Physical review. B, Condensed matter.
[14] T. Arias,et al. Iterative minimization techniques for ab initio total energy calculations: molecular dynamics and co , 1992 .
[15] J. O. Suh,et al. Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects , 2005 .
[16] Nikhilesh Chawla,et al. Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation , 2004 .
[17] Kian Meng Lim,et al. First-principles calculations of structural and mechanical properties of Cu6Sn5 , 2006 .
[18] K. Lim,et al. Structural and mechanical properties of Sn-based intermetallics from ab initio calculations , 2006 .
[19] Wang,et al. Accurate and simple analytic representation of the electron-gas correlation energy. , 1992, Physical review. B, Condensed matter.
[20] J. Nye. Physical Properties of Crystals: Their Representation by Tensors and Matrices , 1957 .
[21] M. Gillan,et al. The Energetics of Frenkel Defects in Li2O from First Principles , 1992 .
[22] J. Watt,et al. Hashin-Shtrikman bounds on the effective elastic moduli of polycrystals with orthorhombic symmetry , 1979 .
[23] Gautam Ghosh,et al. Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging , 2004 .
[24] K. Tu,et al. Tin–lead (SnPb) solder reaction in flip chip technology , 2001 .
[25] Thirumany Sritharan,et al. Interface reaction between copper and molten tin–lead solders , 2001 .
[26] Klein,et al. First-principles calculation of the elastic moduli of Ni3Al. , 1991, Physical review. B, Condensed matter.
[27] Y. Chan,et al. Reliability studies of surface mount, solder joints-effect of Cu-Sn intermetallic compounds , 1995 .
[28] K. Tu. Cu/Sn interfacial reactions: thin-film case versus bulk case , 1996 .
[29] H. Iwasaki,et al. Lattice modulation in the long-period superstructure of Cu3Sn , 1983 .
[30] Burke,et al. Generalized Gradient Approximation Made Simple. , 1996, Physical review letters.