Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem

[1]  P. Thomas.  SOME CONDUCTION PROBLEMS IN THE HEATING OF SMALL AREAS ON LARGE SOLIDS , 1957 .

[2]  V. Hein.  Convection and conduction cooling of substrates containing multiple heat sources , 1967 .

[3]  R. Jaeger,et al.  Optimal Sizing of Planar Thermal Spreaders , 1994 .

[4]  V. Kadambi,et al.  An analysis of the thermal response of power chip packages , 1985, IEEE Transactions on Electron Devices.

[5]  R. David,et al.  Computerized Thermal Analysis of Hybrid Circuits , 1977 .

[6]  A. L. Palisoc,et al.  Thermal analysis of integrated circuit devices and packages , 1989 .

[7]  Allie M. Smith,et al.  General Expressions for Circular Constriction Resistances for Arbitrary Flux Distribution , 1976 .

[8]  D. J. Nelson,et al.  Thermal interaction of semiconductor devices on copper-clad ceramic substrates , 1991 .

[9]  P. A. Schumann,et al.  Application of Multilayer Potential Distribution to Spreading Resistance Correction Factors , 1969 .

[10]  G. Ellison,et al.  Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface , 1976 .

[11]  James V. Beck,et al.  On the Nondimensionalization of Constriction Resistance for Semi-infinite Heat Flux Tubes , 1989 .

[12]  David P. Kennedy,et al.  Spreading Resistance in Cylindrical Semiconductor Devices , 1960 .

[13]  Alfonso Ortega,et al.  Substrate conduction mechanisms in convectively cooled simulated electronic packages , 1991, 1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium.