论文信息 - Challenges in introducing high-density interconnect technology in printed circuit boards for space applications - 字舞流文

Challenges in introducing high-density interconnect technology in printed circuit boards for space applications

B. Vandevelde | M. Cauwe | S. Heltzel | Chinmay Nawghane | Marnix Van De Slyeke | Alexia Coulon

[1] Joelle L. Bennett,et al. Advanced PCB technologies for space and their assessment using up-to-date standards , 2021, CEAS Space Journal.

[2] Bart Vandevelde,et al. High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications , 2020 .

[3] Mario Buffardo,et al. Implementation of double insulation at satellite level: an approach , 2019, 2019 European Space Power Conference (ESPC).

[4] M. Pecht,et al. Development of a Microvia Fatigue Life Model Using a Response Surface Method , 2019, IEEE Transactions on Device and Materials Reliability.

[5] David Nevo,et al. Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications , 2018, Composite Structures.

[6] M. Pecht,et al. Effects of Voiding on the Degradation of Microvias in High Density Interconnect Printed Circuit Boards Under Thermomechanical Stresses , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[7] Bill Birch,et al. Reliability testing for microvias in printed wire boards , 2009 .

[8] Lockheed Martin,et al. EVALUATION OF THE USE OF ENEPIG IN SMALL SOLDER JOINTS , 2016 .

[9] M. Martiny,et al. Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications , 2014, Microelectron. Reliab..