Electrical properties of hollow glass particle filled vinyl ester matrix syntactic foams

Low dielectric constant materials play a key role in modern electronics. In this regard, hollow particle reinforced polymer matrix composites called syntactic foams may be useful due to their low and tailored dielectric constant. In the current study, vinyl ester matrix/glass hollow particle syntactic foams are analyzed to understand the effect of hollow particle wall thickness and volume fraction on the dielectric constant of syntactic foams. The dielectric constant is found to decrease with increase in the hollow particle volume fraction and decrease in the wall thickness. Theoretical estimates are obtained for the dielectric constant of syntactic foams. Parametric studies are conducted using the theoretical model. It is found that a wide range of syntactic foam compositions can be tailored to have the same dielectric constant, which provides possibility of independently tailoring density and other properties based on the requirement of the application.

[1]  P. Morshuis,et al.  Dielectric behavior of syntactic foams at low temperatures and frequencies , 2007, 2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena.

[2]  A. Schnettler,et al.  The impact of water absorption on the dielectric properties of syntactic foam , 2010, 2010 10th IEEE International Conference on Solid Dielectrics.

[3]  B. Zhu,et al.  Thermal, dielectric and compressive properties of hollow glass microsphere filled epoxy-matrix composites , 2012 .

[4]  C. Xie,et al.  Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites , 2009 .

[5]  D. Pinisetty,et al.  Thermal expansion behavior of hollow glass particle/vinyl ester composites , 2012, Journal of Materials Science.

[6]  M. Porfiri,et al.  Effect of volume fraction and wall thickness on the elastic properties of hollow particle filled composites , 2009 .

[7]  K. Hoo,et al.  Experimental determination of the thermal conductivity of three-phase syntactic foams , 2006 .

[8]  M. McHenry,et al.  Induction heating of FeCo nanoparticles for rapid rf curing of epoxy composites , 2009 .

[9]  P. Morshuis,et al.  Permittivity in Epoxy based Syntactic Foam Nanocomposites , 2008, 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena.

[10]  Willi Volksen,et al.  Low dielectric constant materials. , 2010, Chemical reviews.

[11]  M. Porfiri,et al.  Thermal conductivity of multiphase particulate composite materials , 2009 .

[12]  Soo-Jin Park,et al.  Preparation and physical properties of hollow glass microspheres-reinforced epoxy matrix resins , 2005 .

[13]  N. Gupta,et al.  High strain rate compressive response of syntactic foams: Trends in mechanical properties and failure mechanisms , 2011 .

[14]  Kaushik Bhattacharya,et al.  A computational model of ferroelectric domains. Part I: model formulation and domain switching , 2005 .

[15]  S. Priya,et al.  Characterization of Mechanical and Electrical Properties of Epoxy-Glass Microballoon Syntactic Composites , 2006 .

[16]  Hong-jie Liu,et al.  Review of polymer materials with low dielectric constant , 2010 .

[17]  A. Schnettler,et al.  Accelerated hydrothermal aging of epoxy resin based syntactic foams with polymeric microspheres , 2012, IEEE Transactions on Dielectrics and Electrical Insulation.

[18]  Yongxing Shen,et al.  Dielectric behavior of three-phase percolative Ni–BaTiO3/polyvinylidene fluoride composites , 2002 .

[19]  G. Maier Low dielectric constant polymers for microelectronics , 2001 .

[20]  P. Gonon,et al.  Dielectric properties of epoxy/silica composites used for microlectronic packaging, and their dependence on post-curing , 2001 .

[21]  M. Porfiri,et al.  Comparison of tensile and compressive characteristics of vinyl ester/glass microballoon syntactic foams , 2010 .

[22]  J. Ansermet,et al.  Dielectric study of hollow microsphere composites , 1994 .

[23]  C. Xie,et al.  Study on the properties of the epoxy‐matrix composites filled with thermally conductive AlN and BN ceramic particles , 2010 .

[24]  Kishore,et al.  Studies on compressive failure features in syntactic foam material , 2001 .

[25]  B. Scaife,et al.  Principles of dielectrics , 1989 .

[26]  N. Jayasundere,et al.  Dielectric constant for binary piezoelectric 0‐3 composites , 1993 .

[27]  M. Porfiri,et al.  Effect of polydispersivity and porosity on the elastic properties of hollow particle filled composites , 2010 .

[28]  Paul A Kohl,et al.  Low-dielectric constant insulators for future integrated circuits and packages. , 2011, Annual review of chemical and biomolecular engineering.