New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level

In this paper various non-standard methods and instruments for the functional, yield and reliability analysis of MEMS are discussed. Most of these methods are based on existing instruments, involving electrical, optical or mechanical measurements. We present either alternative applications of existing techniques, new methodology for data extraction, or adaptation/automation of the techniques for automatic chip or wafer level measurements.

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