Residual stress measurement method in MEMS microbeams using frequency shift data

The dynamical behaviour of a set of gold microbeams affected by residual stress has been studied. Experimental frequency shift curves were obtained by increasing the dc voltage applied to the specimens. Comparison with different analytical and numerical models has been carried out in order to identify both analytical and finite element models in the presence of residual stress. Residual strain and stress, due to the fabrication process, have been widely reported in the literature in both out-of-plane microcantilevers and clamped–clamped microbeams by using mainly the value of pull-in voltage and static deflection data. In the case of a microcantilever, an accurate modelling includes the effect of the initial curvature due to microfabrication. In double-clamped microbeams, a pre-load applied by tensile stress is considered. A good correspondence is pointed out between measurements and numerical models so that the residual stress effect can be evaluated for different geometrical configurations.

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