A generic method for thermal multiport model generation of IC packages

The dynamic thermal behaviour of electronic subsystems is characterised by their dynamic compact models. These models must be similar to the steady state models in describing the fact that the heat is usually leaving from different locations (ports), necessitating multi-port description of the thermal behaviour. In this paper, we present a method suitable for direct generation of multi-port dynamic compact thermal models from a series of thermal transient simulations or measurements. The generated RC electrical equivalent circuit model exercised with a network simulator program provided the same transient functions as the simulated ones for various boundary conditions, proving the accuracy of the method. Measurement results are also suitable for compact model generation.

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