Antenna-in-Package and Transmit–Receive Switch for Single-Chip Radio Transceivers of Differential Architecture

A fully differential architecture from the antenna to the integrated circuit is proposed for radio transceivers in this paper. The physical implementation of the architecture into truly single-chip radio transceivers is described for the first time. Two key building blocks, the differential antenna and the differential transmit-receive (T-R) switch, were designed, fabricated, and tested. The differential antenna implemented in a package in low-temperature cofired-ceramic technology achieved impedance bandwidth of 2%, radiation efficiency of 84%, and gain of 3.2 dBi at 5.425 GHz in a size of 15 x 15 x 1.6 mm3. The differential T-R switch in a standard complementary metal-oxide-semiconductor technology achieved 1.8-dB insertion loss, 15-dB isolation, and 15-dBm 1-dB power compression point (P 1dB) without using additional techniques to enhance the linearity at 5.425 GHz in a die area of 60 x 40 mum2.

[1]  Chang-Ching Wu,et al.  A 0.13/spl mu/m CMOS T/R switch design for ultrawideband wireless applications , 2006, 2006 IEEE International Symposium on Circuits and Systems.

[2]  Y.P. Zhang,et al.  Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers , 2005, IEEE Transactions on Antennas and Propagation.

[3]  Kyutae Lim,et al.  Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications , 2004, IEEE Transactions on Advanced Packaging.

[4]  Dimitri Linten,et al.  An ESD-Protected DC-to-6GHz 9.7mW LNA in 90nm Digital CMOS , 2007, 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.

[5]  K. O. Kenneth,et al.  A 0.5-μm CMOS T/R switch for 900-MHz wireless applications , 2001, IEEE J. Solid State Circuits.

[6]  M. Schwerd,et al.  Wide-band VCOs in SiGe production technology operating up to about 70 GHz , 2003, IEEE Microwave and Wireless Components Letters.

[7]  Y.P. Zhang Finite-difference time-domain analysis of integrated ceramic ball grid array package antenna for highly integrated wireless transceivers , 2004, IEEE Transactions on Antennas and Propagation.

[8]  Y.P. Zhang Integrated circuit ceramic ball grid array package antenna , 2004, IEEE Transactions on Antennas and Propagation.

[9]  S.S. Wong,et al.  Integrated CMOS transmit-receive switch using LC-tuned substrate bias for 2.4-GHz and 5.2-GHz applications , 2004, IEEE Journal of Solid-State Circuits.

[10]  Ahmadreza Rofougaran,et al.  A 5-GHz direct-conversion CMOS transceiver utilizing automatic frequency control for the IEEE 802.11a wireless LAN standard , 2003, IEEE J. Solid State Circuits.

[11]  Zuo-Min Tsai,et al.  Design and analysis for a miniature CMOS SPDT switch using body-floating technique to improve power performance , 2006, IEEE Transactions on Microwave Theory and Techniques.

[12]  I. Koh,et al.  Package-level integrated antennas based on LTCC technology , 2006, IEEE Transactions on Antennas and Propagation.

[13]  He Li,et al.  A Differential CMOS T/R Switch for Multistandard Applications , 2006, IEEE Transactions on Circuits and Systems II: Express Briefs.

[14]  Gunter Fischer,et al.  A Transceiver Front-End for Ultra-Wide-Band Applications , 2007, IEEE Transactions on Circuits and Systems II: Express Briefs.

[15]  K.K. O,et al.  5.8-GHz CMOS T/R switches with high and low substrate resistances in a 0.18-μm CMOS process , 2003, IEEE Microwave and Wireless Components Letters.

[16]  Zhenbiao Li,et al.  5.8-GHz CMOS T/R switches with high and low substrate resistances in a 0.18-μm CMOS process , 2003 .

[17]  E. Westerwick,et al.  5-GHz CMOS radio transceiver front-end chipset , 2000, IEEE Journal of Solid-State Circuits.

[18]  T. Yoshimasu,et al.  ESD protection of RF circuits in standard CMOS process , 2002, 2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280).

[19]  L. Roy,et al.  Planar antennas in LTCC technology with transceiver integration capability for ultra-wideband applications , 2006, IEEE Transactions on Microwave Theory and Techniques.

[20]  R. Meys,et al.  Measuring the impedance of balanced antennas by an S-parameter method , 1998 .