论文信息 - Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials - 字舞流文

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

Chih-Chia Cheng | Chih-Wei Chiu | Chen-yang Huang | Jian-xun Chen | Kuo-Chan Chiou | Tzong-Ming Lee | Yu-Chian Soong | William Anderson Lee Sanchez | Ying-Nan Chan