Wear resistant electrically conductive Au–ZnO nanocomposite coatings synthesized by e-beam evaporation

[1]  W. Sawyer,et al.  Measurement Uncertainties in Wear Rates , 2009 .

[2]  W. Brown,et al.  The electrical and mechanical properties of Au–V and Au–V2O5 thin films for wear-resistant RF MEMS switches , 2008 .

[3]  W. Brown,et al.  The influence of vanadium alloying on the elevated-temperature mechanical properties of thin gold films , 2007 .

[4]  Masaru Kato,et al.  Some recent developments in non-cyanide gold plating for electronics applications , 2004 .

[5]  Paul Goodman,et al.  Current and future uses of gold in electronics , 2002 .

[6]  Y. Okinaka,et al.  Some recent topics in gold plating for electronics applications , 1998 .

[7]  M. Antler,et al.  Gold plated contacts: effect of thermal aging on contact resistance , 1997, Electrical Contacts - 1997 Proceedings of the Forty-Third IEEE Holm Conference on Electrical Contacts.

[8]  D. McLachlan,et al.  Equations for the conductivity of macroscopic mixtures , 1986 .

[9]  M. Antler,et al.  Fretting corrosion of gold-plated connector contacts☆ , 1981 .

[10]  M. Antler Tribology of metal coatings for electrical contacts , 1981 .

[11]  C. Lo,et al.  Hardening mechanisms of hard gold , 1979 .

[12]  M. Pinnel Diffusion-related behaviour of gold in thin film systems , 1979 .

[13]  M. R. Pinnel,et al.  Relative rates of nickel diffusion and copper diffusion through gold , 1977 .

[14]  M. R. Pinnel,et al.  Low‐temperature diffusion of copper through gold , 1976 .

[15]  J. Bennett,et al.  Qualitative observations on the diffusion of copper and gold through a nickel barrier , 1976 .

[16]  H. Tompkins Diffusion of Cobalt out of Cobalt‐Hardened Gold Measured with Auger Electron Spectroscopy , 1975 .

[17]  M. Shatzkes,et al.  Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces , 1970 .

[18]  O. Hunderi,et al.  On the Zener drag , 1985 .