Thermal analysis of electronic packaging structure using isogeometric boundary element method

Abstract The purpose of this paper is to carry out heat transfer analysis of integrated circuit (IC) packaging structures by the isogemoetric boundary element method (IGABEM). In service time, chips of electronic packaging structure produce lots of heat, which leads to resultant equations including domain integrals. In this work, the radial integration method is used to deal with domain integrals caused by the heat source. Since material properties of electronic packaging structure are piecewise continuous, the subregion isogemoetric boundary element method is introduced in the present IGABEM. In addition, the multi-scale property of structure leads to challenge of IGABEM analysis in electronic packaging problems. This largely results from the difficulty of integrating nearly singular integrals in an accurate and efficient manner. To deal with this problem, a hybrid nearly singular integration scheme, which delivers results of engineering accuracy in an optimal time is used in this work. Finally, a set of numerical examples demonstrate the ability of the present IGABEM to produce accurate temperature distributions.